Crossbar diode-switched magnetoresistive random access memory system

ABSTRACT

A magnetic memory or MRAM memory system comprising an M×N crossbar array of MRAM cells. Each memory cell stores binary data bits with switchable magnetoresistive tunnel junctions (MJT) where the electrical conductance changes as the magnetic moment of one electrode (the storage layer) in the MJT switches direction. The switching of the magnetic moment is assisted by a phase transition interlayer that transitions from antiferromagnetic to ferromagnetic at a well defined, above ambient temperature.

BACKGROUND

Magnetoresistive random access memory (MRAM) is a non-volatile computermemory type that stores data with magnetic storage elements. Themagnetic storage elements (or cells) usually are formed from twoferromagnetic plates, each of which can hold a magnetic field, separatedby a thin insulating layer. One of the two plates is a permanent magnetset to a particular polarity. The other plate's field changes to matchthat of an external field.

A magnetic memory device typically comprises an array of such memorycells, each cell being individually addressable by a particular wordline and bit line arranged at right angles, above and below the cell,respectively. When current is passed through them, an induced magneticfield is created at the junction, which the writable plate picks up, inorder to write data to the memory cell. It should be noted that asmagnetic memory cells are scaled down in size, there comes a time whenthe induced field used to write data to a particular cell overlapsadjacent cells over a small area, leading to potential false writes.

Reading of the memory cells is accomplished by measuring the electricalresistance of the cell. A particular cell typically is selected bypowering an associated transistor, which switches current from a supplyline through the cell to ground. Due to the magnetic tunnel effect, theelectrical resistance of the cell changes due to the orientation of thefields in the two plates. By measuring the resulting current, theresistance inside any particular cell can be determined, and from thisthe polarity of the writable plate.

It is known to use bilayer in MRAM storage elements that comprises (i) amagnetically hard layer and (ii) a switching material, like FeRh, thatexhibits a transition from antiferromagnetic to ferromagnetic at atransition temperature less than the Curie temperature of themagnetically hard layer to assist in the control of switching the memorycell. Published U.S. patent application Pub. No. 2005/0281081 A1describes one such memory cell.

SUMMARY

The present invention is directed to an MRAM memory system comprising anM×N crossbar array of MRAM cells. Each memory cell stores binary databits with switchable magnetoresistive tunnel junctions (MJT) where theelectrical conductance changes as the magnetic moment of one electrode(the storage layer) in the MJT switches direction. The switching of themagnetic moment is assisted by a phase transition interlayer thattransitions from antiferromagnetic to ferromagnetic at a well defined,above ambient temperature. Further, each memory cell comprises atwo-terminal diode, which prevents unwanted parasitic current loopsduring write and read operations. Further, the use of a vertically diodedramatically reduces the complexity and the number of steps involved infabricating the MRAM system. It also allows the memory cells to bepacked more densely than conventional RAM. The two-terminal diode maybe, for example, a semiconductor p-n junction diode, a Schottky diode,or a metal-insulator-metal diode.

The MRAM system, according to various embodiments, combines majoradvantages of several popular memory technologies. First, like flashmemory, it is truly non-volatile. Second, the memory cells 10 havehigher speeds than flash memory. In fact, the memory cells of thepresent invention can be made even faster than DRAM, and close to SRAM.Third, unlike phase-change memory (PRAM), which has lifetime issues, theMRAM cells of the present invention can have basically unlimitedwrite-erase life cycles. Forth, the crossbar circuit approach offersextremely high device density, much higher than the emerging ZRAM (ITDRAM). Finally, because an MRAM cell can retain its memory without theneed of refreshing, the MRAM system of the present invention shouldconsume less power than volatile memories. These and other advantages ofthe present invention will be apparent from the description to follow.

FIGURES

Various embodiments of the present invention are described herein by wayof example in conjunction with the following figures, wherein:

FIG. 1 is a diagram of a memory cell according to various embodiments ofthe present invention;

FIG. 2 is a plot of the magnetization curve as a function of temperaturefor FeRh;

FIG. 3 is a chart showing the magnetization curves for FeRh and FeRhIras a function of temperature;

FIGS. 4( a)-(c) illustrate the state of the memory cell at varioustemperature levels according to various embodiments of the presentinvention;

FIG. 5 is a diagram of a MRAM system according to various embodiments ofthe present invention;

FIGS. 6( a)-(b) illustrate a scheme that utilizes the word lines togenerate localized perpendicular magnetic fields according to variousembodiments of the present invention;

FIGS. 7( a)-(d) illustrate different embodiments of the memory cellaccording to the present invention;

FIGS. 8( a)-(k) illustrate a process for fabricating the MRAM systemaccording to various embodiments of the present invention; and

FIG. 9 illustrates a computing device according to various embodimentsof the present invention.

DESCRIPTION

Various embodiments of the present invention are directed to MRAM systemcomprising an M×N crossbar array of MRAM cells. FIG. 1 is a diagram of amemory cell 10 according to various embodiments of the presentinvention. The memory cell 10 comprises a magnetic storage (or MRAM)element 12 and a two-junction diode 24. The diode 24, according to theembodiment shown in FIG. 1, comprises a p-doped layer 26 and an n+ dopedlayer 28, forming a p-n diode junction. The p-doped layer 26 may serveas the diode anode and the n+ dopes layer 28 may serve as the diodecathode. The p-doped layer 26 may comprise p-doped poly silicon and then+ doped layer 28 may comprise n+ doped silicon.

The magnetic storage element 12 comprises a first magnetic layer (or“storage layer”) 14 and a second magnetic layer (or “reference layer”)16, and a tunnel barrier layer 18 between the storage and referencelayers 14, 16. The magnetic storage element 12 also comprises a phasetransition interlayer 20 adjacent to the storage layer 14, and amagnetic assist layer 22 adjacent to the phase transition interlayer.

The magnetization of the reference layer 16 is fixed in theperpendicular direction with a relatively large perpendicular anisotropyfield, as indicated by the vertical arrow in FIG. 1. The magneticstorage layer 14 preferably comprises small magnetic grains, each with astrong uniaxial magnetic anisotropy and a magnetic easy axisperpendicular to the film plane, such that the magnetization orientationof the storage layer 14 can be switched in the perpendicular direction,as indicated by the double-headed vertical arrow in FIG. 1, representingthe two different memory states of the cell 10. The magnetocrystallineperpendicular anisotropy of the storage layer 14 only needs to besufficient for memory state retention against thermal energy and otherdisturbing sources. The reference layer 16 comprises a magnetic materialsuch as, for example, a multi-layer structure of Co/Pt, Co/Pd, or Co/Ni.The storage layer 14 may comprise a magnetic material such as, forexample, Co alloys, FePt (L1₀), CoPt, FePd, AlMn, or other L1₀materials. The thicknesses of the storage layer 14 and the referencelayer 16 may be between five and 20 nm, respectively.

The tunnel barrier layer 18 may comprise a dielectric material, such asAlO_(x), MgO_(x), TiO_(x), or any other suitable oxide or dielectric,and have a thickness of about 0.5 nm to five nm. The tunnel barrierlayer 16, sandwiched between the two magnetic layers 14, 16, may act asa barrier layer of a magnetic tunnel junction (MJT).

The magnetic assist layer 22 preferably comprises small magnetic grains,each grain having a strong uniaxial magnetic anisotropy and a magneticeasy axis in the film plane (i.e., in the x-direction in the example) asindicated by the horizontal arrow in the magnetic assist layer 22 inFIG. 1. The magnetic assist layer 22 may comprise a magnetic materialsuch as, for example, Co alloys, FePt (L1₀), CoPt, FePd, AlMn, or otherL1₀ materials, and may have a thickness of between five and twenty nm.For example, the assist layer 22 may comprise CoIr, which is an hcpstructure with a large negative K1 at room temperature if the Irconcentration is around 15% to 20%, the advantageousness of which willbe apparent from the description to follow.

The phase transition interlayer 20 is between the storage layer 14 andthe assist layer 22. The phase transition interlayer 20 may comprise amaterial with small magnetic grains that switches from antiferromagneticat ambient to ferromagnetic at or above a transition temperature(T_(A-F)) that is greater than ambient. One such material is FeRh (B2),which experiences a first order phase transformation at a transitiontemperature T_(A-F) that can range from 300° K and 500°K, depending onthe film texture and the underlayer used. This is much less than theCurie temperature for FeRh, which is in the range of 673° K to 950° K.Also, such heating (e.g., 300° K to 500° K) typically would have littleeffect on the perpendicular and in-plane magnetic layers 14, 16. Asshown in FIG. 2, the phase below the transition temperature T_(A-F) isantiferromagnetic while above the transition temperature the materialbecomes ferromagnetic. The sharp transition between antiferromagneticphase and ferromagnetic phase, as shown in the example of FIG. 2,effectively enhances the spatial gradient and limits the size of thephase transformed spot. Recent experimental study has shown that theantiferromagnetic to ferromagnetic phase transformation occurs wellwithin the deep sub-nanosecond regime. The phase transition interlayer20 may have a thickness of between one nm and ten nm, for example.

In another embodiment, the phase transition interlayer 20 may compriseFe_(x)(Rd_(100-y)My)_(100-x), where M is selected from the groupconsisting of Ir, Pt, Ru, Re, and Os. In addition, y is preferablybetween zero and fifteen inclusive (i.e., 0≦y≦15). Addition of the thirdelement M may allow the transition temperature to be tuned (e.g.,increased). FIG. 3 shows how the transition temperature can be increasedby adding 3% Ir. Other possible materials for the phase transitioninterlayer 14 include MnZn, SmZn, GdZn, TbZn, DyZn, HoZn, and ErZn.

According to various embodiments, when the interlayer 20 is inantiferromagnetic phase (or non-magnetic phase), there exists littlemagnetic coupling between the two adjacent ferromagnetic layers 14, 22.When the interlayer 20 changes to ferromagnetic phase (i.e., when it isheated to or above the transition temperature T_(A-F)), the interlayer20 couples the magnetic moments of the two adjacent layers 14, 22ferromagnetically. The exchange coupling between the phase transitioninterlayer 20 and the in-plane magnetic assist layer 22 causes thein-plane magnetic assist layer 22 to exert an effective magnetic fieldthat is significantly stronger (such as 100 times stronger) that fieldsthat can be applied artificially (e.g., externally applied). As aresult, if the anisotropy field-thickness product of the two layers 14,22 is similar and the coupling is sufficiently strong, the effectivemagnetic anisotropy of the storage layer 14 and the assist layer 22essentially vanishes. Hence, writing of the storage layer 14 can beachieved easily with a field that needs only to be a few percent of theambient anisotropy field of the storage layer 14.

According to other embodiments, the two-terminal diode 24 may be aSchottky diode or a metal-insulator-metal diode, or any other suitabletwo-terminal diode device.

FIGS. 4( a)-(c) illustrate the magnetic orientation of the storage layer14, the phase transition interlayer 20, and the assist layer 22 atvarious temperatures. FIG. 7( a) shows the magnetic orientation when thetemperature of the interlayer 20 is below the transition temperature. Inthis temperature range, the interlayer 20 is antiferromagnetic and thereis little coupling between the storage layer 14 and the assist layer 22.FIG. 4( b) shows the magnetic orientation after the interlayer 20 hasbeen heated to or above the transition temperature T_(A-F). Theinterlayer 20 may be heated, for example, by the heat radiated from aheater layer 32 (see FIG. 1) that radiates heat when conducting current.As shown in FIG. 4( b), when the temperature of the interlayer 20 isabove the transition temperature T_(A-F) (but below the Curietemperature), the interlayer 20 is ferromagnetic, resulting inferromagnetic exchange coupling between the storage layer 14 and theassist layer 22, substantially reducing the switching field of thestorage layer 14. As such, as shown in FIG. 4( c), a magnetic field H atconventional strength can cause the magnetization of the storage layer14 to reverse its direction. The heat may then be removed and theinterlayer 20 may cool to a temperature below the transition temperatureT_(A-F), with the magnetization of the storage layer 14 remaining in itsreversed state. In this way, the memory cell can be used for recordingbinary data.

The exchange coupling strength for the interlayer 20 in theferromagnetic phase can be tuned by changing the interlayer thickness asdescribed in U.S. patent application Ser. No. 11/700,308, filed Jan. 31,2007, which is incorporated herein by reference.

Returning to FIG. 1, the n+ layer 28 of the diode 24 may serve as a bitline for the memory cell 10. In addition, the memory cell 10 maycomprise a conductive word line 30, perpendicular to the bit line 28, onthe opposite end of the memory cell 10. According to variousembodiments, as shown in FIG. 1, the heater layer 32 may be adjacent tothe word line 30. When conducting current between the word line 30 andthe bit line 28, the heater later 32 radiates heat to heat the phasetransition interlayer 20 to cause the phase transition interlayer 20 totransition from antiferromagnetic to ferromagnetic. The heater layer 32preferably comprises an electrically conductive material with arelatively high electrical resistance, such as tungsten. 10020 Accordingto various embodiments, an MRAM system 40, shown in FIG. 5, may comprisea crossbar array of such memory cells 10. The MRAM system 40 maycomprise M word lines 30 and N bit lines 28, with M×N memory cells 10.The diode 24 associated with each memory cell 10 is used to address thememory cells 10 individually.

The magnetic field used to switch the memory state of the storage layer14 can be generated globally or generated by running a small current atthe word lines 30, as shown in FIGS. 6( a)-(b). The heating currentrequires no directionality and is, therefore, suited for thediode-enabled write addressing in the crossbar architecture. Since theAF-F transition temperature of the phase transition interlayer 20 can bemade relatively low through selection of the material and thickness ofthe phase transition interlayer 20, natural heating from the heatinglayer 32 should be sufficient to cause the phase transition interlayer20 to transition from AF to F. The magnetic tunnel junction is the highimpedance portion of the memory cell 10 and bears most of the voltagedrop besides that of the diode 24. The ballistic tunneling electronsquickly diffuse in the arriving electrode (either the storage layer 14or the reference layer 16, depending on the direction of the currentflow), thereby dissipating heat. Therefore, the direction of thecurrent, i.e., the direction of the tunneling electrons, should stronglyaffect the heating of the phase transition interlayer 20. It should benoted that the switching of the magnetoresistive tunneling junction isnot accomplished via bipolar spin torque in such an embodiment, butrather by the assistance of the thermally induced transition of thephase transition interlayer 20.

In the embodiment of the memory cell 10 shown in FIG. 1, the anode ofthe diode 24 is immediately adjacent to the reference layer 16, as shownin FIG. 7( a). According to other embodiments as shown in FIGS. 7(b)-(d), other structures for the memory cell 10 could be used. FIG. 7(b) shows an embodiment where the diode cathode is adjacent to thereference layer 16. FIG. 7( c) shows an embodiment where the diode anodeis adjacent to the assist layer 22. FIG. 7( d) shows an embodiment wherethe diode cathode is adjacent to the assist layer 22. Preferably, all ofthe memory cells 10 of the array 24 have the same structure.

FIGS. 8( a) through 8(k) illustrate a process for fabricating the MRAMarray 40 according to various embodiments. First, as shown in FIG. 8(a), the silicon layer 50 of a silicon-on-insulator (SOI) wafer, actingas the substrate, is degenerately doped and annealed as an n+material52, which will be used to form the bit lines 28 in subsequent steps.Next, a p-type polysilicon layer 54 is deposited using, for example,low-pressure chemical vapor deposition (LPCVD).

Next, as shown in FIG. 8( b), the following layers can be depositedsequentially: the magnetic reference layer 56; a dielectric layer 58 toform the tunnel barrier; the magnetic storage layer 60; the phasetransition interlayer (e.g., FeRh) 62; the magnetic assist layer 64; andthe heating material layer 66. The layers 56-66 may be deposited using,for example, ion sputtering deposition techniques, although any othersuitable deposition techniques could be used.

Next, as shown in FIG. 8( c), a first lithography mask 68 is applied topattern the memory cells 10. The mask 68 can be prepared with optical,electronbeam, or nanoimprint lithography techniques. Next, as shown inFIG. 8( d), ion milling and reactive ion etching (RIE) can be used tocreated isolated multilayered lines 70. Next, as shown in FIG. 8( e), alow-k dielectric 72 may be deposited between the isolated multilayeredlines 70 and planarized using CMP (chemical-mechanical-planarization),removing the mask 68.

Next, as shown in FIGS. 8( f) and 8(g), a second lithography step can beused to pattern the word lines 30, which are orthogonal to the bit lines28, using a second mask 76. FIG. 8( f) is a front view of the structure,showing the N bit lines 28, and FIG. 8( g) is a side view showing the Mword lines 30.

Next, as shown in FIGS. 8( h) and 8(i), a combination of ion milling andRIE can be utilized, using the mask 76, to create the individual memorycells 10, connected by respective word lines 30 and bit lines 28.Finally, as shown in FIGS. 8( j) and 8(k), a low-k dielectric can bedeposited between the memory cells, and the entire structure can beplanarized using CMP, removing the mask 76 in the process. A topinsulating layer (not shown) may be formed on the word lines and thememory cells, etc.

The MRAM system 40, according to various embodiments, combines majoradvantages of several popular memory technologies. First, like flashmemory, it is truly non-volatile. Second, the memory cells 10 havehigher speeds than flash memory. In fact, the memory cells 10 can bemade even faster than DRAM, and close to SRAM. Third, unlikephase-change memory (PRAM), which has lifetime issues, the MRAM cells 10has basically unlimited write-erase life cycles. Forth, the crossbarcircuit approach offers extremely high device density, much higher thanthe emerging ZRAM (1T DRAM). Finally, because an MRAM cell can retainits memory without the need of refreshing, the MRAM system 40 shouldconsume less power than volatile memories.

FIG. 9 is a diagram of a computing device 100 according to variousembodiments of the present invention. The computing device 100 includesa processor 102 in communication with a memory controller 104 through abus 106. The memory controller 104 is in communication with the memorysystem 40 described above a bus 108. The computing device 100 may be,for example, a personal computer (PC), a workstation, a laptop computer,a server, a supercomputer, a personal digital assistant (PDA), apocket-PC, or any other device comprising a memory and a processor.

In accordance with other embodiments, the MRAM system 40 could beincorporated onto a chip or substrate with other circuitry, such as partof a system-on-chip (SOC) application or other type of integratedcircuit. For example, the MRAM system 40 could be fabricated on asemiconductor substrate on which other circuitry, such as a processor,etc., is also fabricated. For example, in a SOC having a number ofmemory units, at least one of the memory units could be a MRAM system 40as described above.

While several embodiments of the invention have been described, itshould be apparent, however, that various modifications, alterations andadaptations to those embodiments may occur to persons skilled in the artwith the attainment of some or all of the advantages of the presentinvention. For example, some of the various materials described aboveare exemplary, and other materials could be used in certain instances.It is therefore intended to cover all such modifications, alterations,and adaptations without departing from the scope and spirit of thepresent invention as defined by the appended claims.

1. A memory cell comprising: a 2-terminal diode; and a magnetic storageelement adjacent to the diode, wherein the magnetic storage elementcomprises: a perpendicular anisotropy magnetic reference layer; aperpendicular anisotropy magnetic storage layer; a tunnel junctionbetween the reference layer and the storage layer; an in-plane magneticassist layer; and a phase transition interlayer between the storagelayer and the assist layer, wherein the phase transition interlayercomprises a material that switches from antiferromagnetic toferromagnetic at a transition temperature that is greater than ambient.2. The memory cell of claim 1, wherein the diode comprises asemiconductor p-n junction diode.
 3. The memory cell of claim 1, whereinthe diode comprises a Schottky diode.
 4. The memory cell of claim 1,wherein the diode comprises a metal-insulator-metal diode.
 5. The memorycell of claim 1, wherein the phase transition interlayer comprises FeRh.6. The memory cell of claim 1, wherein the transition temperature isbetween 300° K and 500° K.
 7. The memory cell of claim 1, wherein thediode comprises an n-type layer and a p-type layer, wherein the magneticreference layer is adjacent the p-type layer.
 8. The memory cell ofclaim 1, wherein the diode comprises an n-type layer and a p-type layer,wherein the magnetic reference layer is adjacent the n-type layer. 9.The memory cell of claim 1, wherein the diode comprises an n-type layerand a p-type layer, wherein the magnetic assist layer is adjacent thep-type layer.
 10. The memory cell of claim 1, wherein the diodecomprises an n-type layer and a p-type layer, wherein the magneticassist layer is adjacent the n-type layer.
 11. The memory cell of claim1, wherein the magnetic assist layer comprise CoIr.
 12. The memory cellof claim 1, further comprising a heater layer adjacent to the magneticstorage element.
 13. The memory cell of claim 12, wherein the heaterlayer is adjacent to the assist layer.
 14. An MRAM system comprising: Nword lines; M bit lines orthogonal to the word lines; and M×N MRAMcells, one of the M×N MRAM being located between each intersection ofone of the N word lines and one of the M bit lines, wherein each memorycell comprises: a 2-terminal diode; and a magnetic storage elementadjacent to the diode, wherein the magnetic storage element comprises: aperpendicular anisotropy magnetic reference layer; a perpendicularanisotropy magnetic storage layer; a tunnel junction between thereference layer and the storage layer; an in-plane magnetic assistlayer; and a phase transition interlayer between the storage layer andthe assist layer, wherein the phase transition interlayer comprises amaterial that switches from antiferromagnetic to ferromagnetic at atransition temperature that is greater than ambient.
 15. The MRAM systemof claim 14, wherein the phase transition interlayer comprises FeRh. 16.The MRAM system of claim 14, wherein the transition temperature isbetween 300° K and 500° K.
 17. The MRAM system of claim 14, wherein thediode comprises an n-type layer and a p-type layer, wherein the magneticreference layer is adjacent the p-type layer.
 18. The MRAM system ofclaim 14, wherein the diode comprises an n-type layer and a p-typelayer, wherein the magnetic reference layer is adjacent the n-typelayer.
 19. The MRAM system of claim 14, wherein the diode comprises ann-type layer and a p-type layer, wherein the magnetic assist layer isadjacent the p-type layer.
 20. The MRAM system of claim 14, wherein thediode comprises an n-type layer and a p-type layer, wherein the magneticassist layer is adjacent the n-type layer.
 21. The MRAM system of claim14, wherein the magnetic assist layer comprise CoIr.
 22. The MRAM systemof claim 14, wherein each memory cell comprises a heater layer adjacentto the magnetic storage element.
 23. The MRAM system of claim 22,wherein the heater layer is adjacent to the assist layer.
 24. The MRAMsystem of claim 14, wherein the diode comprises a diode selected fromthe group consisting of a semiconductor p-n junction diode, a Schottkydiode, and a metal-insulator-metal diode.
 25. A computing devicecomprising: a processor; and a memory controller in communication withthe processor; and a MRAM system in communication with the memorycontroller, wherein the MRAM system comprises: N word lines; M bit linesorthogonal to the word lines; and M×N MRAM cells, one of the M×N MRAMbeing located between each intersection of one of the N word lines andone of the M bit lines, wherein each memory cell comprises: a 2-terminaldiode; and a magnetic storage element adjacent to the diode, wherein themagnetic storage element comprises: a perpendicular anisotropy magneticreference layer; a perpendicular anisotropy magnetic storage layer; atunnel junction between the reference layer and the storage layer; anin-plane magnetic assist layer; and a phase transition interlayerbetween the storage layer and the assist layer, wherein the phasetransition interlayer comprises a material that switches fromantiferromagnetic to ferromagnetic at a transition temperature that isgreater than ambient.
 26. A method of fabricating a magnetic memorydevice, comprising: sequentially depositing a plurality of thin films ona substrate and patterning the deposited thin films to form: a pluralityof bit lines; a plurality of magnetic memory cells on each bit line,wherein the magnetic memory cells comprise: a 2-terminal diode; and amagnetic storage element adjacent to the diode, wherein the magneticstorage element comprises: a perpendicular anisotropy magnetic referencelayer; a perpendicular anisotropy magnetic storage layer; a tunneljunction between the reference layer and the storage layer; an in-planemagnetic assist layer; and a phase transition interlayer between thestorage layer and the assist layer, wherein the phase transitioninterlayer comprises a material that switches from antiferromagnetic toferromagnetic at a transition temperature that is greater than ambient;and a plurality of word lines, orthogonal to the bit lines, wherein eachword line is connected to a subset of the magnetic memory cells, suchthat each magnetic memory cell is between one bit line and one wordline.
 27. The method of claim 26, wherein the substrate comprises asilicon-on-insulator wafer.
 28. The method of claim 26, wherein thediode comprises a diode selected from the group consisting of asemiconductor p-n junction diode, a Schottky diode, and ametal-insulator-metal diode.
 29. The method of claim 26, wherein thephase transition interlayer comprises FeRh.
 30. The method of claim 26,wherein the transition temperature is between 300° K and 500° K.
 31. Themethod of claim 26, wherein the diode comprises a p-type layer adjacentto an n-type layer.
 32. The method of claim 31, wherein the magneticreference layer is adjacent the p-type layer.
 33. The method of claim31, wherein the magnetic reference layer is adjacent the n-type layer.34. The method of claim 31, wherein the magnetic assist layer isadjacent the p-type layer.
 35. The method of claim 31, wherein themagnetic assist layer is adjacent the n-type layer.
 36. The method ofclaim 31, wherein the magnetic assist layer comprise CoIr.
 37. Themethod of claim 26, wherein patterning the deposited thin filmscomprises at least two separate lithographic etching steps.
 38. Anintegrated circuit, comprising: an MRAM system, wherein the MRAM systemcomprises: N word lines; M bit lines orthogonal to the word lines; andM×N MRAM cells, one of the M×N MRAM being located between eachintersection of one of the N word lines and one of the M bit lines,wherein each memory cell comprises: a 2-terminal, diode; and a magneticstorage element adjacent to the diode, wherein the magnetic storageelement comprises: a perpendicular anisotropy magnetic reference layer;a perpendicular anisotropy magnetic storage layer; a tunnel junctionbetween the reference layer and the storage layer; an in-plane magneticassist layer; and a phase transition interlayer between the storagelayer and the assist layer, wherein the phase transition interlayercomprises a material that switches from antiferromagnetic toferromagnetic at a transition temperature that is greater than ambient.